{
  "id": "CVE-2023-33063",
  "url": "https://spydr.io/cve/CVE-2023-33063",
  "published": "2023-12-05T03:15:12.067Z",
  "modified": "2026-06-17T06:00:38.380Z",
  "score": 7.8,
  "severity": "high",
  "cvss_version": "3.1",
  "vector": "CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H",
  "score_source": "NVD",
  "epss": 0.00672,
  "epss_percentile": 0.50455,
  "exploited": true,
  "kev": {
    "added": "2023-12-05",
    "due": "2023-12-26",
    "action": "Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.",
    "ransomware": "Unknown",
    "name": "Qualcomm Multiple Chipsets Use-After-Free Vulnerability",
    "notes": "This vulnerability affects a common open-source component, third-party library, or a protocol used by different products. Please check with specific vendors for information on patching status. For more information, please see: https://git.codelinaro.org/clo/la/kernel/msm-5.15/-/commit/2643808ddbedfaabbb334741873fb2857f78188a, https://git.codelinaro.org/clo/la/kernel/msm-4.14/-/commit/d43222efda5a01c9804d74a541e3c1be9b7fe110; https://nvd.nist.gov/vuln/detail/CVE-2023-33063"
  },
  "ssvc_exploitation": "active",
  "vendors": [
    "Qualcomm, Inc.",
    "qualcomm"
  ],
  "products": [
    "Qualcomm, Inc. Snapdragon",
    "qualcomm 315_5g_iot_modem_firmware",
    "qualcomm apq8017_firmware",
    "qualcomm aqt1000_firmware",
    "qualcomm ar8031_firmware",
    "qualcomm ar8035_firmware",
    "qualcomm ar9380_firmware",
    "qualcomm c-v2x_9150_firmware",
    "qualcomm csr8811_firmware",
    "qualcomm csra6620_firmware",
    "qualcomm csra6640_firmware",
    "qualcomm csrb31024_firmware",
    "qualcomm fastconnect_6200_firmware",
    "qualcomm fastconnect_6700_firmware",
    "qualcomm fastconnect_6800_firmware",
    "qualcomm fastconnect_6900_firmware",
    "qualcomm fastconnect_7800_firmware",
    "qualcomm flight_rb5_5g_platform_firmware",
    "qualcomm immersive_home_214_platform_firmware",
    "qualcomm immersive_home_216_platform_firmware"
  ],
  "cwes": [
    "CWE-416"
  ],
  "description": "Memory corruption in DSP Services during a remote call from HLOS to DSP.",
  "status": "Analyzed",
  "score_type": "Primary",
  "scores": {
    "cvss_v40": null,
    "cvss_v31": 7.8,
    "cvss_v30": null
  },
  "references": [
    {
      "url": "https://www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin",
      "tags": [
        "Patch",
        "Vendor Advisory"
      ]
    },
    {
      "url": "https://www.cisa.gov/known-exploited-vulnerabilities-catalog?field_cve=CVE-2023-33063",
      "tags": [
        "US Government Resource"
      ]
    }
  ],
  "nvd_url": "https://nvd.nist.gov/vuln/detail/CVE-2023-33063",
  "covered_in": [],
  "attribution": [
    {
      "source": "NVD",
      "url": "https://nvd.nist.gov",
      "notice": "This product uses data from the NVD API but is not endorsed or certified by the NVD."
    },
    {
      "source": "CISA KEV",
      "url": "https://www.cisa.gov/known-exploited-vulnerabilities-catalog",
      "notice": "Known exploited vulnerabilities from the CISA KEV catalog."
    },
    {
      "source": "FIRST EPSS",
      "url": "https://www.first.org/epss",
      "notice": "Exploit prediction scores from FIRST EPSS."
    }
  ]
}