CVE-2023-33063
Qualcomm, Inc. Snapdragon, qualcomm 315_5g_iot_modem_firmware, qualcomm apq8017_firmware
Published 5 Dec 2023 · updated 17 Jun 2026 · Analyzed
7.8 High · CVSS 3.1, NVD
Exploited in the wild
CISA added this to its Known Exploited Vulnerabilities catalog on 5 Dec 2023, with a remediation deadline of 26 Dec 2023 for US federal agencies.
Required action: Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.
Description
Memory corruption in DSP Services during a remote call from HLOS to DSP.
References
- www.qualcomm.com/company/product-security/bulletins/december-2023-bulletin · Patch, Vendor Advisory
- www.cisa.gov/known-exploited-vulnerabilities-catalog?field_cve=CVE-2023-33063 · US Government Resource